How Hindley Circuits increased its inspection capabilities
“A large factor of why people choose us is the quality of build. With this investment and the unit being supported by Altus, we can double down on that strength moving forward.”
Richard Whitehead,
Chief Executive Officer – Hindley Circuits
BACKGROUND
Following a successful onsite trail, Hindley Circuits, provider of high quality electronic PCB assembly services for a range of industrial products has chosen to install an X-Scope 3000 X-Ray Inspection System from Scienscope. With business growing, the company is making many investments in the latest equipment to improve processes and ensure they have the capability to deliver even the most intricate PCB assembly service to the highest levels of accuracy. Looking to increase quality even further and improve production times, Hindley Circuits approached Altus to recommend what innovative equipment would enable precise inspection with the highest performance to price ratio.
THE SOLUTION
After consultation with the experts at Altus and a short trial, Scienscope-Scope 3000 X-Ray Inspection System was installed.
“The X-ray investment is the latest in a stream of process improvements we have made over the last years to increase our inspection capabilities and adds to the 3D Koh Young AOI that we already utilise on site,” said
Richard Whitehead, Chief Executive Officer- Hindley Circuits.
“Our ambition is to keep offering our partners the very highest level of contract manufacturing and a large factor of why people choose us is the quality of build. With this investment and the unit being supported by Altus, we can double down on that strength moving forward.”
X-SCOPE 3000
X-Scope 3000 X-Ray Inspection System offers many advantages to help inspect highly complex PCBAs. Key factors of importance for Hindley Circuits included the machines intuitive graphical user interface allowing advanced inspection routines and the ability to auto-void calculation and the auto reporting of results. The X-Scope 3000 excellent price to performance was another huge influence in selecting the system.
KEY FACTORS:
- Works on many applications, from multilayer PCBs and semiconductors, to BGA, QFN, encapsulated components
and molded plastic + Fully integrated, 110 or 130kV high power micro-focus closed
x-ray tube - Spot size down to 54+4” x3” high resolution CMOS digital flat panel image detector + 50° detector tilt for oblique angle viewing
- Large 25.4” x 19.5” Inspection area
- Color mapping camera with zoom window for easy location and identification of faults
- Z axis movement of the x-ray tube and detector
- Computer controlled kV and mA settings
- Computer controlled variable speed XY stage
- Simple point and click, intuitive GUI provides access to create advanced inspection routines
- BGA Void detection and automatic calculations
- Easy macro recording for intuitive step and repeat programming
- Various measuring tools for radius, area, perimeter, etc
FINAL THOUGHT
Tony Sweetman, Altus Sales Manager said: “We are delighted that Hindley chose our recommendation for X-ray and have invested in the X Scope 3000. We believe that we have a great offering for the CEM space as the Xray systems offer very high quality images, auto void calculation and auto reporting all of which are vital for the modern CEM environment. Congratulations to Hindley and their team!”
